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In-Depth Review Of Apple’s New M1 Pro And M1 Max Chips

The new M1 chips from Apple are the first generation of the company’s new mobile processors. These two SoCs (System on Chips) – or, more accurately put by Apple, “System in a Package” (SiP), feature a custom ARMv8-based CPU and an integrated Application Processor (AP). The M1 is built on TSMC’s 16nm FinFET process node, features LTE Category 6 modem with speeds up to 300 Mb/s downlinks and 50 Mb/s uplink, as well as WLAN connectivity.

While most tech-savvy people would have been watching Cupertino last Monday thinking that WWDC is going to be all about software this time around – meaning macOS 10.12, iOS 10, watchOS 3, and tvOS 10 – that is quite far from the truth. In fact, Apple announced a whole bunch of new stuff, including a brand-new chipset in the form of M1 SiP (System in a Package).

For those who are not familiar with it yet, let’s make a little introduction to these new custom ARM chipsets by Apple. We’ll start with some general information about them and then we will focus on both SoCs separately for an in-depth look at what they have to offer compared to their predecessors.

Apple released two products based on M1 SiP: iPhone SE  and 9.7-inch iPad Pro. This means that there are two different models of iPhones and iPads powered by the Apple M1 SiP. The iPhone has a single-core CPU and is manufactured in a package measuring 25 x 25 mm, while the iPad Pro comes in a larger package measuring at least 32mm x 21mm, likely due to size constraints caused by 4G/LTE modem, which occupies substantial space on a PCB (printed circuit board).

All in all, one can say that Apple’s new chipsets are much more powerful compared to their predecessors from the A8 generation released back in 2014. Not only do they offer higher performance and better energy efficiency but also vastly improved connectivity options with both WLAN and LTE Category 6 available right out of the box.

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